Description
The X2000 DF Series is LIMATA’s latest laser direct imaging system platform designed for the dry-film patterning of PCB inner and outer layers in medium to high-volume PCB production. Key target applications include standard rigid/flex, advanced (HDI) and custom PCB boards (i.e. thick copper automotive boards). Fully-integrated single and dual-system automation options for an Island of Automation or in-line LDI operation Setup can be provided.
Key system features
- Integrated dual table system as standard hardware feature for higher production efficiency and throughput levels (panels/h)
- Multi-wavelength laser set-up with >18.000 hours lifetime (MTBF)
- Highest optical depth of focus (+/-500µm)
- Unique modular imaging head concept provides for laser redundancy and in-field system capacity upgrades (additional imaging units)
- Direct imaging capability on all standard resist types (Hitachi, Asahi, etc.)
- Ease-of-use operator friendly data interface
- Designed to minimize maintenance, downtimes and service costs over the entire LDI equipment lifetime
Laser and imaging technologies
- High-speed Galvo-Scan Laser Technology
- UV-Multiwave diode laser set-up including three different wavelenghts
- High-telecentrical optical system
Modular laser direct imaging set-up
- Based on each customer‘s PCB specification, L/S resolution and direct imaging capacity requirements, the optimum laser imaging Setup (ranging from 1 to 4 exposure heads with up to 6 diode lasers each) can be selected and configured according to customer needs
- Possibilty to conduct in-field laser upgrades for increased imaging capacities (additional imaging heads) enabled by a modular „plug-in“ concept
Imaging and Software options
Adjustable laser spot size for advanced HDI production (High-Resolution)
Detection of multiple fiducials for maximum registration accuracy
Automated tracking of individual Barcodes or serial numbers for full product traceability
MES-interface and Secs/Gem programming options (“real-time“ production data)
LDI Automation (Island of Automation / In-line)
The X2000 platform can be complemented by a robotic set-up for a fully automated and less labor intensive LDI in-line operation
PCB Applications (dry film patterning)
Standard PCB and HDI
- Standard (rigid)
- Standard (flex)
- Standard (rigid-flex)
- Any layer PCB / mSAP (semi-additive)
Thick copper PCB applications
- IMS
- DCB (direct copper bonded)
Available system configurations (dry film patterning)
X2000 DF Standard PCB set-up
- Direct imaging (patterning) of Rigid / Flex and
HDI applications
X2000 DF Custom PCB set-up
- Direct imaging of Thick copper PCB applications (i.e. automotive / industrial)
- Customized system features include:
– Customized XY Gantry system
– Customized vacuum table
X2000 automation options
- Single LDI robot-automation
- Dual LDI robot-automation
X2000 automation options
- Single LDI robot-automation
- Dual LDI robot-automation