PCB Solder Mask Imaging


The LIMATA X2000 SM Series is LIMATA’s latest laser direct imaging system platform designed for the imaging of Solder Mask applications in high-volume PCB production environments.

LIMATA’s combined UV/IR imaging approach for solder mask applications accelerates the UV polymerization process and ensures significant higher throughput levels (surfaces per hour) on high-energy solder resist inks.

Fully-integrated single and dual-system automation options for an Island of Automation or in-line LDI operation Setup can be provided.

Key system features

  • New flexible laser direct imaging platform for the maskless direct imaging of green, black, blue, white and red colored solder resists
  • Integrated dual table system as standard hardware feature for higher production efficiency and throughput levels (panels/h)
  • Multi-wavelength laser set-up with >18.000 hours lifetime (MTBF)
  • Use of three different laser-wavelengths to optimize solder resist exposure
  • LIMATA’s proprietary UV/IR solder mask imaging technology accelerates imaging speed on all standard solder mask materials (i.e. Tayio)
  • RGB & IR camera lightning for easy fiducial detection on all solder mask colors
  • Laser mirror system with perfect power dissipation (no water cooling/ no power limitations)
  • Highest optical depth of focus for an uniform power distribution on copper and base material
  • Unique modular imaging head concept provides for in-field system capacity upgrades (additional imaging units or IR modules)
  • Direct imaging capability on all standard solder resist types (i.e. Tayio)
  • Ease-of-use operator friendly data interface
  • Designed to minimize maintenance, downtimes and service costs over the entire LDI equipment lifetime

Laser and imaging technologies

  • High-speed Galvo-Scan Laser Technology
  • UV- diode laser set-up with 4/6 laser configurations per exposure unit
  • IR-Module (for solder mask applications) / LUVIR Technology
  • Highly telecentrical optical system

Modular laser direct imaging set-up

  • Based on the specific solder resist type and color, energy levels (mJ/cm2) and direct imaging capacity requirements, the optimum UV-laser and IR-imaging Setup (ranging from 1 to 4 laser exposure heads and IR modules) can be selected and configured according to individual customer needs
  • Possibilty to conduct in-field laser upgrades for increased imaging capacities (additional imaging heads and IR modules) enabled by a modular „plug-in“ concept
4 Imaging Heads SM

Imaging and Software options


Adjustable laser spot size for advanced HDI production (High-Resolution)

Partial Registration
Partial Registration

Detection of multiple fiducials for maximum registration accuracy


Automated tracking of individual Barcodes or serial numbers for full product traceability

MES interface
MES interface

MES-interface and Secs/Gem programming options (“real-time“ production data)

LDI Automation (Island of Automation / In-line)

The X2000 platform can be complemented by a robotic set-up for a fully automated and less labor intensive LDI operation

The X2000 platform can be complemented by a robotic set-up for a fully automated and less labor intensive LDI in-line operation

PCB Applications (solder mask imaging)

Standard PCB and HDI

  • Standard (rigid)
  • Standard (flex)
  • Standard (rigid-flex)
  • Any layer PCB
  • mSAP (semi-additive)

Solder resist colors

  • Green
  • Black
  • Blue
  • White
  • Red

Data-Sheets (X2000SM)