Description
The LIMATA X2000 SM Series is LIMATA’s latest laser direct imaging system platform designed for the imaging of Solder Mask applications in high-volume PCB production environments.
LIMATA’s combined UV/IR imaging approach for solder mask applications accelerates the UV polymerization process and ensures significant higher throughput levels (surfaces per hour) on high-energy solder resist inks.
Fully-integrated single and dual-system automation options for an Island of Automation or in-line LDI operation Setup can be provided.
Key system features
- New flexible laser direct imaging platform for the maskless direct imaging of green, black, blue, white and red colored solder resists
- Integrated dual table system as standard hardware feature for higher production efficiency and throughput levels (panels/h)
- Multi-wavelength laser set-up with >18.000 hours lifetime (MTBF)
- Use of three different laser-wavelengths to optimize solder resist exposure
- LIMATA’s proprietary UV/IR solder mask imaging technology accelerates imaging speed on all standard solder mask materials (i.e. Tayio)
- RGB & IR camera lightning for easy fiducial detection on all solder mask colors
- Laser mirror system with perfect power dissipation (no water cooling/ no power limitations)
- Highest optical depth of focus for an uniform power distribution on copper and base material
- Unique modular imaging head concept provides for in-field system capacity upgrades (additional imaging units or IR modules)
- Direct imaging capability on all standard solder resist types (i.e. Tayio)
- Ease-of-use operator friendly data interface
- Designed to minimize maintenance, downtimes and service costs over the entire LDI equipment lifetime
Laser and imaging technologies
- High-speed Galvo-Scan Laser Technology
- UV- diode laser set-up with 4/6 laser configurations per exposure unit
- IR-Module (for solder mask applications) / LUVIR Technology
- Highly telecentrical optical system
Modular laser direct imaging set-up
- Based on the specific solder resist type and color, energy levels (mJ/cm2) and direct imaging capacity requirements, the optimum UV-laser and IR-imaging Setup (ranging from 1 to 4 laser exposure heads and IR modules) can be selected and configured according to individual customer needs
- Possibilty to conduct in-field laser upgrades for increased imaging capacities (additional imaging heads and IR modules) enabled by a modular „plug-in“ concept
Imaging and Software options
Adjustable laser spot size for advanced HDI production (High-Resolution)
Detection of multiple fiducials for maximum registration accuracy
Automated tracking of individual Barcodes or serial numbers for full product traceability
MES-interface and Secs/Gem programming options (“real-time“ production data)
LDI Automation (Island of Automation / In-line)
The X2000 platform can be complemented by a robotic set-up for a fully automated and less labor intensive LDI in-line operation
PCB Applications (solder mask imaging)
Standard PCB and HDI
- Standard (rigid)
- Standard (flex)
- Standard (rigid-flex)
- Any layer PCB
- mSAP (semi-additive)
Solder resist colors
- Green
- Black
- Blue
- White
- Red