X3000

Description

The LIMATA X3000 Series is an unique laser direct imaging system platform designed for the imaging (patterning) of oversized PCB boards. The X3000 series can image panel sizes of up to 110” x 48” with highest LDI precision in registration and resolution. A hybrid system Setup can be configured for PCB customers who want to process both, dry-film patterning and solder mask imaging, on one LDI system platform.

Key system features

Working/Imaging area of up 110” x 48 provides for extreme large panel manufacturing
Multi-wavelength laser set-up with >25.000 hours lifetime (MTBF)
Highest optical depth of focus (+/-500µm)
Unique modular imaging head concept provides for laser redundancy and in-field system capacity upgrades (additional imaging units)
Direct imaging capability on all standard resist types (Hitachi, Asahi, etc.)
Ease-of-use operator friendly data interface
Designed to minimize maintenance, downtimes and service costs over the entire LDI equipment lifetime

Optional Solder mask imaging capability

LIMATA’s proprietary UV/IR solder mask imaging technology accelerates imaging speed on all standard solder mask materials (i.e. Tayio)
RGB & IR camera lightning for easy fiducial detection on all solder mask colors

Laser and imaging technologies

High-speed Galvo-Scan Laser Technology
UV-Multiwave diode laser set-up with three different wavelenghts
High-telecentrical optical system
Optional: IR module for solder mask imaging of XXL boards

Modular laser direct imaging set-up

Based on each customer‘s individual oversized PCB specification, L/S resolution and direct imaging capacity requirements (prints/hour), the optimum laser imaging Setup (ranging from 1 to 4 exposure heads with up to 6 diode lasers each) can be selected and configured according to customer needs
Optional: IR module for solder mask imaging capabilities
Possibilty to conduct in-field laser upgrades for increased imaging capacities (additional imaging heads) enabled by a modular „plug-in“ concept